Nā kumu kumu hoʻonā
E noi i ke kaʻina hana patented wai e hoʻomaikaʻi i ke ola o ka huahana
Ma muli o ka pono wai a me ka seismic o ka patent aupuni "integrated molding injection" kaʻina hana ʻenehana, hoʻomaikaʻi nui ka huahana i ke ola o ka huahana i ka hoʻohana paʻakikī.
Kūpono me nā ʻano protocols kamaʻilio, hōʻike pololei SOC
Hiki ke hoʻopili ʻia me CAN, 485 a me UART a me nā protocols kamaʻilio ʻē aʻe, hiki ke hoʻokomo ʻia i ka hōʻike koho, a i ʻole ma o Bluetooth link mobile phoneAPP, a i ʻole PC kamepiula "host" polokalamu, e hoʻokō i ka hōʻike pololei o ke koena o ka mana pākaukau.
Hoʻohui i ka hana wahi mamao no ka huli maʻalahi
Ma o ke kūlana ʻelua o Beidou a me GPS, me ke kelepona kelepona APP, hiki ke nānā ʻia ka wahi a me ke ala kelepona o ka pākaukau ma ka pūnaewele i ka lā a pau, kahi kūpono e loaʻa i kēlā me kēia manawa.
nā kumu kūpono no ke koho ʻana i kahi hopena no ka ʻōnaehana hoʻokele pākaukau lithium
ʻO DALY, kou hoa hilinaʻi
Kāhea iā mā˚ou
Palena keʻena
Helu helu:
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